• 10 MP 3-D stacked imager
  • Global shutter pixel with dual gain and in-pixel CDS
  • 2 µm ADC pitch
  • Global shutter and rolling shutter pixel driver
  • 120 frames per second
  • 12-bit column-parallel ADC
  • 1.1/2.5/2.8/3.3 volt supplies
  • 2.2 Gbps CML serial interface
  • 3D stacked process
    • Top layer: BSI imager chip in 65nm
    • Bottom layer: logic chip in 40nm